Printed Circuit Board Design Engineer
A highly regarded, seasoned, accomplished, and well-qualified Electrical/Electronic CAD Design Professional with 25+ years of comprehensive experience. Proven experience in various types of printed circuit board designs, electrical CAD designs, and drafting. Recognized as a results oriented, productive self-starter with a strong work ethic, and a consistent record of reaching and often exceeding goals. Works well under pressure and with minimum supervision. A collaborative communicator with demonstrated superior levels of oral and written communications, and the ability to build and nurture strategic relationships with peers, management teams, internal departments, and clients.
Core Competencies include:
Ethernet Switch PCB design | I/O Board Design | Test Board Design |Switching Power Supply | Chip-on-Board | DFM | Multi-Layer Boards | Double-Sided Boards | Single-Sided Boards | Signal Integrity | Controlled Impedance | Micro-Strip | Strip-Line | Via-in-Pad | Micro-Vias | Blind Vias | Back-Drilling | BGA | Through-Hole | SMT | Industrial Controls | Panel Design | Wiring Design | Physical Conduit Layout | Onsite Inspections | Ladder Diagrams | Cadence Allegro V16.6, V17.2 | Orcad Schematic Capture CIS V16.6, V17.2 | PCAD 2006| CAM350 | AutoCAD 2014| Allegro Constraint Manager | IPC 2221 | IPC 2222 | IPC 7351
Professional Experience
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Phoenix Nuclear Labs | SR. PCB DESIGNER - CONTRACT | 6/2017 TO 1/2018
PCB Design for Neutron Generators used in Medical Isotope Production and Neutron Radiography. The Printed Circuit Boards designed for these projects interface with sensors internal to the unit and to external controls. The Printed Circuit Boards for these projects involve mixed signal Digital/ Analog and high voltage up to 300V. Printed Circuit Boards are designed to IPC 2221 and IPC 7351 specifications and built to IPC 6012 specifications. Physically, these boards are two to six layers with surface mounted components mounted on both sides of the board.
Selected Contributions:
• Mixed signals designs
• Orcad PCB Professional V17.2 PCB Design, Orcad CIP Schematic Capture, Constraints manager
MOLEX, INC. | PCB DESIGNER | 11/2003 TO 5/2017
Charged with design of high-speed test boards used to evaluate newly-developed electrical connectors for the Consumer Products Division (CPD), including impedance-controlled, matched-length differential, strip-line traces up to 30 layers; successfully testing > 25Gbs. Design printed circuit boards in compliance with IPC-2221, IPC-2222, and IPC-6012 Standards. Designed PCB's with back-drilling, laser and blind vias, up to 30 layers, 0.032" to .254" thick. Ethernet Switch PCB designs with POE and without POE power incorporating Molex ICM modules, Marvel and Broadcom PHY chips.
Cadence Allegro is the main PCB Design software used to created the printed circuit boards mentioned above. Orcad Schematic Capture CIS is used to create the schematics. Schematic symbols/ components are picked by company part number or value via Microsoft Access database. The Access database maps the correct PCB Footprints to the schematic symbol. Once the schematic has been completed, a Netlist is created and then imported into Cadence Allegro. Constraint Manager is used for required PCB design rules implementations and is set up in the Allegro environment.
Common constraints defined specific PCB Design Rules including Impedance Controlled Differential Pair and Single-Ended trace parameters such as Max. Length, Matched Lengths within the pairs, Trace Width and Spacing, selected vias for specific net parameters. Antipad (Copper to Trace/ Pad Air Gaps) geometries are also defined using the Constraint Manager.
Selected Contributions:
• Design Printed Circuit Boards for Molex' Integrated Connector Module (ICM).
• Design Printed Circuit Board using a proprietary PHY chip by IBM capable of running at 25Gbs while interfacing with Molex' Impact Connector.
• Ethernet Switch PCB design
• Cadence Library Creation/ Development
MOLEX FIBER OPTICS DIVISION | ASSOCIATE ENGINEER | 2/2001 TO 11/2003
Tasked with designing fiber optic transceiver printed circuit boards for the Gigabit Interface Convertor (GBIC) and Small Form Factor (SFP) product for the Fiber Optics Division (MFO). Created Designs for Manufacturability (DFM). Developed environmental test board designs for fiber optic transceivers to be used for shock, vibration, temperature, and humidity testing.
PCB Designs had up to 6 layers. The design used 6 mil diameter laser drilled vias, 100 ohm impedance controlled differential signals that were matched length. Board materials used for these boards were FR-408HR. A Chip-on-Board (COB) transceiver was wire-bonded to the board. Trace geometries were 3,3,3 mil trace width, spacing using 1/2 Oz. Cu.
PCad 2004 Schematic Capture and PCB layout tools were used to create the ...
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