Seasoned manufacturing engineer with a record of innovative problem solving, continuous improvement, customer service, effective leadership, optimizing routine tasks, and teamwork.
Accomplishments
- Introduced CNC selective solder to displace drag solder processing and put production back on schedule by eliminating need for custom tooling.
- Adapted new design CCAs to pin-in-paste solder for PTH parts. Eliminated $16K/yr labor and improved cycle time 30%.
- Implemented pre-flight checklist for first time builds. Cross functional coordination eliminated 50% of the cycle time and downtime associated with NPI.
- Transplanted a subcontract coating operation to in-house, moving masking, cleaning, spray and parylene coating processes. Downtime was less than 36 hours.
- Standardized masking: 1 vs 5 types of masking tape for all coatings. Implemented custom and off-the-shelf masking boots and water washable hot melt maskant.
- Upgraded manual parylene coating equipment to one button semi-automated process. A $1200 upgrade to accomplish the same as a $80K machine.
- Developed process parameters for implementing SAC305 lead-free wave solder.
- Upgraded inline aqueous wash to new chemistry and optimized settings via DOE. Eliminated white residue defects and reduced costs 30%, $38K per year.
- Implemented meter-mix for two part adhesives and potting compounds. Reduced material costs, variability, exposure to hazardous materials, waste and cut cycle time by 30%.
- Implemented CNC inline underfill dispensing to reduce labor and cycle time by 65%.
- Deployed in-line CNC selective spray coating to eliminate masking labor and reduce cycle time by up to 75%. Set up two in-line systems for 4 coating chemistries.
- Mathematically modeled solder paste stenciling via Taguchi DOE to find optimum settings to minimize variability.
- Wrote and taught in-house Taguchi Methods and DOE course to managers and engineers.
Employment Background
Honeywell, Clearwater, FL 2011- present
OEM manufacturer of space flight and aerospace products.
+ 2011 – present. AME New Product Development Engineer. Responsible for transitioning new designs from concept to production. Cost reductions and producibility for new designs.
Sparton Electronics, Brooksville, FL 2011
High mix electronics contract manufacturing for Defense/Aerospace and Medical device designs. + 2011. Sr Process engineer responsible for Ersa CNC selective solder, wash lines, bonding/staking, sealing, coating, BGA underfill, designed experiments and facilitating Six Sigma and Lean projects.
GAF Materials Corporation,Tampa,FL 2011
High volume manufacturing: asphalt roofing shingles, laminated and three-tab types, over twelve color schemes. Volume: 500,000+ per day in continuous flow line.
+ 2011. Night shift quality. Responsible for raw materials testing, in-process product sampling and testing, line and product SPC.
Jabil Circuit, St Petersburg, FL 2005- 2011
High mix and volume electronics contract manufacturing for high end Defense/Aerospace. New product introduction and mature product production.
+ 2006 - 2011. Sr Process Engineer and lead person for all chemical processes: wash/cleaning, bonding, potting, BGA underfill, staking, sealing, and conformal coat.
+ 2005 - 2006. Process Engineer. Responsible for DOEs and studies for reducing cost, variability, and defects in volume production. Conducted process transition to lead-free solder
Sypris Electronics (formerly Group Tech), Tampa, FL 1989 - 2005
Systems and subassembly level electronics manufacturing. High mix production of circuit card assemblies and electro-mechanical hardware for industry, aerospace, and government.
+ 2001 - 2005. Principle production engineer. Responsible for Taguchi DOEs, cost reductions, custom mechanical tooling, design-to-production transition of in-house circuit card and box build designs, barcoding, CNC laser etching
+ 1999 - 2001. Unsecured Product and post wave solder assembly team leader and product engineer. Three product lines and supervising 4 production engineers and 3 techs building industrial and unclassified government products.
+ 1994 - 99. Commercial manufacturing Principle Program Engineer: Receiving Inspection, supplier quality, component & vendor engineering, failure analysis, product quality and
producability, corrective actions and metrics reporting to Customers, warranty returns.
+ 1993 - 94. Principle Materials Engineer, responsible for PCBs, connectors, solderability, and Cruise Missile Parts rescreening.
+ 1990 - 93. Manager, Procured Materials Quality, responsible for 3 engineers, 2 aides, 3 technicians, 2 programme...
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