PROFILE:
Hardworking electrical engineer with 1.5 years experience in device fabrication of III-V semiconductors. Strong knowledge of semiconductor device physics. Seeking engineering position (process/manufacturing/application/product engineering). Available immediately
EDUCATION:
1. Lehigh University, Bethlehem, PA (Graduation: May 2010)
M.S. Electrical Engineering, GPA: 3.66/4.00
2. University of Wisconsin - Madison, Madison, WI (Graduation: May 2008)
B.S. Physics, Physics GPA: 3.34/4.00
Relevant coursework: Semiconductor Lasers, Applied Quantum Mechanics, Physics of Semiconductor Device, Metal Semiconductor Heterojunctions, Solid State Physics, Quantum Electronics, Advanced Electromagnetic Waves, Applied Integrated Circuits, Advanced Circuits and Systems.
TECHNICAL SKILLS:
1. Extensive training in semiconductor processing equipments (spin coating, photolithography, electron beam and dielectric depositions, electroplating, plasma enhanced chemical vapor deposition, chemical wet etching, rapid thermal annealing, thermal oxidation, inductively coupled plasma and plasma cleaning).
2. Experienced in material characterization equipments (scanning electron microscopy, surface profilometer, Hall measurement, epsilometer and goniometer).
3. Hands-on experience in electronic testing equipments (frequency generator, semiconductor parameter analyzer, lock-in amplifier, digital oscilloscope, digital multimeter and power supply).
4. Proficient in MS Office (Word, Excel, PowerPoint, Access), data analysis (Originlab), circuit design/simulation (OrCAD, PSPICE), numerical programming (Matlab, Mathematica, Maple, Mathcad, C).
5. Fluent in English and Indonesian (Native).
RELATED EXPERIENCE:
1. Process Technician (December 2010 – July 2011)
OEpic Semiconductors, Inc, Sunnyvale, CA
• Successfully fabricated vertical cavity surface emitting lasers, grating structures, and light emitting diodes based on III-V semiconductor materials (gallium arsenide, indium phosphide and gallium nitride).
• Performed reliability test on vertical cavity surface emitting laser devices based on temperature dependence using semiconductor parameter analyzer.
• Hands-on experience in handling thin semiconductor wafers (~150 µm) and chemicals (acid/base/solvent) safely.
2. Master’s Project (August 2009 - May 2010)
Lehigh University, Bethlehem, PA
• Developed controlled photo-enhanced wet etching using electrodeless electrochemical cell and ultraviolet light source in producing smooth and low damage etched surface profile on n-type gallium nitride semiconductor.
• Created strong dependency between etched surface morphology profile and electrolytic solution concentration using scanning electron microscopy.
• Extensive training in fabricating metal patterned structure on semiconductor surface using semiconductor clean room processing equipments.
3. Research Intern (June 2009 - August 2009)
Singapore Institute of Manufacturing and Technology, Singapore
• Conducted experiment in surface modification on polycarbonate and poly(methyl methacrylate) glass surfaces using plasma surface cleaner and optimized their surface adhesion strength by 100%.
• Generated and confirmed inverse relationship between surface energy and plasma exposure duration using goniometer and tape test method.
• Engaged in daily operation of high vacuum equipments (e...
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