Objective
Seeking for a full-time process engineering position capitalizing on rigorous background in microfabrication with the capacity to work on multiple projects in a dynamic team environment.
Work Eligibility
Citizen of United States of America
Professional Profile
• Hands-on and analytical research skills
• Strong communication and technical writing skills
• Results-driven achiever with strong organizational and time management skills
• Creative thinking ability
• Self-driven with the ability to work independently and with a team to achieve excellence
• Solid work ethic: accuracy, professionalism, reliability, take pride in my work
• Proven leadership skills
• Commitment to diversity
Education
Bachelor of Science, Electrical and Material Science Engineering
• University of California, Davis 9/ 2005 – 12/ 2009
Relevant Courses
• Electronic, Optical and Magnetic Properties of Solid Sate Materials (EMS 172 Grade A)
• Graduate course: Introduction to Micro-fabrication Process (EAD 289 Grade A+)
• Principles of Device Physics (EEC 140A/B Grades B+/ B)
• Device Fabrication (EEC 146A Grade B)
Technical Skills
•Microfabrication skills
Processes: photolithography, metal deposition, mask fabrication, nano-imprint lithography, wet and dry oxidation, wet and dry etching
Operated tools: Dektak Profilometer , E-Beam Evaporator , Magnetron Sputter, Karl Suss and EVG Mask Aligners, MRL oxidation furnaces, Nanonex 2000, Pattern Generator, Reactive Ion Etcher, FEI SEM, SVG Track Coater, Bruker D8 Advance X-Ray Diffractometer, PDS 2010 LabcoterTM 2, Hesse & Knipps Wedge Bonder, Four-Point Probe
• Software skills
AutoCAD, L-Edit, SolidWorks, C, C++, Matlab, PSpice, MS Word, EXCEL, PowerPoint, WordPerfect, Macintosh, Linux, Windows 95/98/2000/XP/Vista/7
Work Experience
Full-time Research Intern, Automation & Robotics Research Institute, UT Arlington, 01/ 2010 – Present
•Microfabrication Process Development
a) Photolithography: S1813, SPR 220, KMPR, SU-8, WL 5150 (Photopatternable Silicone)
b) Metal deposition: Au, Pt, Cr, Ag, NiCr, Ti, Al, Si3N4, Au/Sn alloy
c) Etching: KOH (wet etching), RIE (plasma dry etching), and metal etching
d) Dicing: Laser and Saw
e) Bonding & Packaging: Wedge bonding
f) Testing: Testbed for oxygen, gas, temperature, and humidity
•Material Development
a) Metal oxide inks: metal salt, polymers and solvents
b) Proton Conductive matrix: Nafion, photoactive compounds, polymers, and solvents
c) Material functionality test
•Research Development
a) Characterization of ZnO thin films
b) Thin film solid state sensors: pH and oxygen
c) Metal oxide sensors: gas and humidity
d) Printing solutions for 3D interconnect
e) Flexible microsensors: NiCr temperature sensors on Parylene and PDMS
f) ZnO Nanowires for gas sensing
Part-time Research Assistant, Northern California Nanotechnology Center, UC Davis, 07/ 2008 – 12/ 2009
•Developed cost effective nano-imprint lithography (NIL) process
•Characterized anti sticktion layer by molecular vapour deposition for NIL
•Tracked regular process parameters for oxidation, RIE and NIL
•Trained new lab users for safety procedures and tool operations
Part-time Research Assistant, UC Davis, 12/ 2008 – 12/ 2009
•Investigated the feasibility of microfabrication technology to understand the fundamental of nickel batch fabrication, and to examine the deformation mechanism and dislocation motion at nano-scale
•Assisted with grinding and polishing procedures to prepare nickel sample
•Presented the research project at 20th Davis Undergraduate Research, Scholarship & Creative Conference
Industry (Agilent)/University collaborative Design Project, UC Davis, 01/ 2009 – 06/ 2009
•Improved and developed a cost-effective lead-free solder process in the Eagle Electronic Calibration module manufactured by Agilent Technologies
•Conducted process development for furnace profiling, reliability testing, solder joint strength, Au embrittlement and solder wetting
•Co-author of an abstract for presentation during the symposium titled Pb-Free Solders and Emerging Interconnect and Packaging Technologies at the TMS (The Minerals, Metals, and Materials Society) 2010 annual meeting held at Seattle
Software Intern, KAL-C Precision, Fremont, CA, Summer – 2007
•Designed and created 3D mechanical CAD (MCAD) tools using SolidWorks2006
•Remodeled and upgraded designs using surfaces and complex curving geometry
•Successfully completed training seminar on new features of upgraded version of SolidWorks2006
Leadership & Diversity
WISE (Women in Science and Engineering) Intern, UC Davis, CA, 12/ 2007 - 12/ 2009
•Initiated and implemented seminar , tutorial, and outreach support activities for female students
•Established workshop to promote young girls, ages 10-12, in science and engineering
Awards and Memberships
•Certificate of achievement for undergraduate research at UC Davis
•Nominated for Margarita Robinson Student Leadership Award
•Society of Women Engineers (SWE)
•Institute of Electrical and Electronics Engineers (IEEE)
•American Association of University Women (AAUW)
References
Upon request
Objective
Seeking for a full-time process engineering position capitalizing on rigorous background in microfabrication with the capacity to work on multiple projects in a dynamic team environment.
Work Eligibility
Citizen of United States of America
Professional Profile
• Hands-on and analytical research skills
• Strong communication and technical writing skills
• Results-driven achiever with strong organizational and time management skills
• Creative thinking ability
• Self-driven with the ability to work independently and with a team to achieve excellence
• Solid work ethic: accuracy, professionalism, reliability, take pride in my work
• Proven leadership skills
• Commitment to diversity
Education
Bachelor of Science, Electrical and Material Science Engineering
• University of California, Davis 9/ 2005 – 12/ 2009
Relevant Courses
• Electronic, Optical and Magnetic Properties of Solid Sate Materials (EMS 172 Grade A)
• Graduate course: Introduction to Micro-fabrication Process (EAD 289 Grade A+)
• Principles of Device Physics (EEC 140A/B Grades B+/ B)
• Device Fabrication (EEC 146A Grade B)
Technical Skil...
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