408-646-0037 · 916-933-1693 ·
Motivated Semiconductors Professional with multiple product and technology experience in the Semiconductor Industry. Extensive and complete background in Front-end, Back-end, R&D, Production, University Lab research. Strength in physical analysis and exceptional analytical skills. Solid mathematical, statistical, and programming background. Team player with ability to challenge and motivate a team to achieve extraordinary results. Excellent at serving internal and external customers.
· New Product Development and Launch · Process Redesign / Cost Savings
· Foundries Engineering · Creative Problem Solving
· Yield Improvement · Strong Customer Quality Skills
RELATED EXPERIENCE AND ACHIEVEMENTS:
Infineon Technologies, Morgan Hill, California, 2008 – pres.
A 3,3 billion Euros in sales and 25,000 employees worldwide world leader in semiconductor and system solutions, focusing on three central needs of our modern society: energy efficiency, mobility and security.
Sr. RF Product Engineer, Test and Product Development
Responsible for providing manufacturing and R&D with technical support for high power LDMOS microwave devices to improve product development, introduction, manufacturability and yields.
· Released to production brand new plastic molded RFIC packages platform from $4,8 to $13,6 million in revenue, developed Test and T&R processes for internal and subcons operations
· Upgraded manufacturing capability by accruing and installing customized testers and handlers totaling $900K a year project
· Introduced KGD and TLP test technologies for wafer qualification process to save at least $268K a year
· Driving manufacturing cost reductions to save up to $400K a year
International Rectifier (IR), El Segundo, California, 1999 - 2007
A 1 billion in revenues pioneer and world leader in advanced semiconductors power management technology, from digital, analog and mixed-signal ICs to advanced circuit devices, power systems and components.
Sr. Product Engineer 2002 - 2007
Managed yield improvement of all devices within design platforms. Sustained production devices, SPC, FMA, 8D. Interacted between all groups within corporation in problem solving, yield and quality improvement areas.
· Improved Yield of new generation power MOSFET from 40% to 87% for the SONY PlayStation2. Recovered $450K per month of product revenue
· Redesigned mid-voltage devices platform Process using extensive DOEs for up to 30% yield improvement
· Implemented into production new SuperJunction / CoolMOS (P-columns charge-balance device) platform
· Transferred in-time technologies and equipment overseas and to foundries from R&D Fab headquarters
· Secured Foundries product yield and ensured product Quality
· Received an Award from Project Manager for active participation in environmental ISO14001Certification. Generated process documentation for quality ISO9001 and automotive ISO/TS-16949 Certifications
· Developed back-end Process for industry’s first GaN on Si and Sapphire power MOSFET and IC
Wafer Fab Test Engineer 1999 - 2002
Led Test Module serving both Production and R&D departments. Solely responsible for the discrete components test on the wafer level of silicon based trench and planar power semiconductors (FET, IGBT, Schottky, etc.). Set up and organized Probe Lab (Wafer Sort) from the ground up (equipment, tools, procedures, and documentation).
· Accomplished $1 million production ramp-up to 2500 WIP project: from one ATS to 8 in one year!
· Improved 30% throughput and efficiency by tuned Fast recipes, defined Edge exclusion, and Columns sample probe. Implemented new Qg testers, 15 bins results distribution, One page lot Report system
· Upgraded ATS and layout to accommodate and manage 80% production and 20% engineering lots
· Saved 40% in probe cards cost and improved quality by changing vendor and probes material to Tungsten
· Developed engineering and production test algorithms and routines for ATS: EG 2001 – ipTEST; Wentworth – LTX DS4 to measure DC electrical parametric and dynamic characteristics
· Drove PDF (IDS) software and hardware upgrade from the Fab level to a $350K Corporate project. Managed PDF database and data analysis tools for the yield control, SPC, and reports generation
UDT Sensors, now OSI Optoelectronics, Hawthorne, California, 1997 - 1999
The largest manufacturer of standard and custom photo-detectors, photodiodes and optical sensors in United States. Delivers Commercial and Military Standard X-ray, UV, Visible, NIR photo-sensors, and ceramic hybrid modules.
Product & Test Engineer
Managed Wafer Fab backend processes and yield. Analyzed device failure modes, customer complain...
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