Profile
Experienced, educated, focused, and effective process engineer. Process and quality oriented in manufacturing and R&D environments. The ability to successfully interact with all departments, vendors, and customers.
Specialties Include:
* PCB Fab/Assembly Engineering
* Process development, control and improvement
* NCMR, MRB & Customer RMA evaluation and disposition
* DOE, SPC and FMEA
* Kaizen events
* Vendor evaluation, selection, auditing
* Customer Service Engineer
* Chemical analyses, microsection evaluation
* Incoming inspection, Lamination, Electroplating, Photoprint, Fluidized bed coating, Firing, Etching, Ink making, Screen making/printing, Wave Solder, Vapor Phase and IR Solder Reflow, Thermal Imaging, etc.
Relevant Work History
Process Engineer MAY, 2010 - Present
REMEC Broadband Wireless San Diego, CA
Manufacturer of Microwave Telecommunications Equipment
Member of the Advanced Engineering Group supporting R&D Engineering and Process Development in the manufacture of Microwave Transceiver equipment. Development of PCB and equipment assembly processes and instructions for New Product Introduction. Material selection and testing for enhanced corrosion resistance. Failure analyses and Root Cause and Corrective Actions.
Manufacturing Quality Engineer III JUN, 2008 – JAN, 2010
Suntron Corporation Newburg, OR
Contract EMS Provider
Component Prep, Vapor Phase Reflow, Post Wave Mechanical, Conformal Coat, support to 1st Adds, Wave Solder, 2nd Adds and Box Build. Kaizen events in Conformal Coat and Prep.
Reason for Leaving: Lay off due to facility closing.
Senior Process Engineer, PCB Assembly FEB 2008 – JUN 2008
Fluke Corporation Everett, WA
Manufacturer of Industrial Test and Measurement and Biomedical Equipment
Process areas: Wave Solder, Post-reflow Semi-aqueous and Vapor cleaning, Conformal coating. SMT Stencil Print Kaizen. RoHS compliance issues regarding materials, PCB’s, surface finishes, components, etc.
Reason for Leaving: Resigned – unwilling to relocate to Seattle permanently.
Contract Engineer APR 2007 – JUN 2007
Aerotek
Planar Systems, Inc. Hillsboro, OR
Reason for Leaving: Contract Ended
Senior Product Engineer FEB 2006 – FEB, 2007
TTM Technologies (formerly Tyco Electronics PCB Group) Dallas, OR
Manufacturer of Commercial and Military Printed Circuit Boards
Review of customer prints and specifications. Development of PCB stack ups and impedance modeling. Point of Contact for customer technical questions. Support to Process Engineering. New Product tracking to validate process methods, constructions and impedance performance. Methods engineering.
Reason for Leaving: Lay off due to facility closing.
Development Engineer JAN, 2005 – FEB, 2006
TTM Technologies Chippewa Falls, WI
High Volume Manufacturer of high density Printed Circuit Boards
Evaluation, testing and implementation of printed circuit laminates for Lead-Free and Halogen-Free applications. Experimentation on the effect of moisture content and degree of cure in lamination on the processability of phenolic-type laminates.
Reason for Leaving: Resigned to take better position in OR.
Contract Manufacturing Engineer APR 2003 – JUL 2004
Volt Technical Services Tempe, AZ
Assigned to HEI, Inc.
Manufacturer of high-density rigid-flex electronic interconnects.
Sustaining process engineer for the Photoprint area. Responsibilities encompass supervision, work assignments, product flow and process control. Provide additional manufacturing and process engineering support to other production areas: develop/etch/strip, plating, lamination, final inspection, etc.
Reason for Leaving: Contract ended.
Senior Process Engineer JUL 2001 – OCT 2002
Nanotron, Inc. Tempe, AZ
Start up manufacturer of electrolytic tilt sensors
Move R&D facility mode from pilot production to full-scale manufacturing. Reduce product variation by implementing controls into the screen printing, ink making, firing and electrolyte injection processes.
Reason for Leaving: Lay off due to facility closing.
Process Engineer III OCT 1999 – JUL 2001
Sanmina Corporation Phoenix, AZ
High Volume Manufacturer of Printed Circuit Boards
Surface Finishing Department
Process control for Screen Making and Screen Printing Legend and Via Plug, for Solder Mask application, and for Hot Air Solder Leveling and Hot Oil Reflow.
Reason for Leaving: Lay off due to lack of work.
Senior Manufacturing Engineer MAR, 1993 – OCT, 1999
Durel Corporation Chandler, AZ
Manufacturer of Flexible Electroluminescent Lamps
Process control/scale up for ink making, phosphor manufacture and fluidized bed coating operations, screen making and screen printing, chemical etching. 24 hour on-call coverage. Process optimization by use of DOE.
Reason for Leaving: Resigned to re...
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