Commodity Manager & Supply Chain Manager with Strong Engineering (Process, Materials, Equipment) Background
Highly motivated, quality-focused, result-oriented, and dedicated materials, equipment, and process development engineer with nine years of experience in semiconductor packaging, Fab manufacturing, and supplier management. Proven ability to drive cost, quality, availability, technology, manufacturability, and Environmental Social Governance (ESG) sustainability. Thrive in deadline-driven environments. Capable to effectively prioritize projects within schedule, budget, and quality guidelines. Proficient in delivering novel tactical and strategic solutions for direct/alternate sourcing. Excellent interpersonal and negotiation skills to drive cost reduction, supplier lead-time reduction and on time delivery. Poised and competent with demonstrated ability to easily transcend cultural differences.
Areas of Expertise
Project Management, Leadership in Supplier Management, Supplier Selection & Global Sourcing and Procurement, Negotiation/Supply Chain Management, Microelectronic Packaging, Wafer Fabrication, Lean Manufacturing Principles, Lean Six Sigma, High Volume Manufacturing Deployment, Statistical Process Control, Problem Solving, Statistical Design of Experiments, Cost Improvements, Polymer Chemistry, Process Development and Optimization
Professional Experience
Intel Corporation, Chandler, AZ (Sept ’03 to Present)
Supply Chain/Commodity Manager, Technology Manufacturing Engineering
* Lead spares management to maximize total cost of ownership; manage cost, schedule and scope of assigned contacts & suppliers to assure best quality at best value
* Develop new supply sources where vendors and suppliers are inadequate including make-versus-buy analysis, sourcing & vendor qualification criteria
* Work with suppliers to manage the total spares business including procurement, sourcing suppliers, negotiating commercial contracts, and cost management & inventory
* Manage overall supply chain operations, including purchasing and inventory of materials as well as selection of vendors; make recommendations to improve productivity, quality, and efficiency of operations
* Perform cost analysis, capacity analysis and volume planning for major commodities to ensure quality, cost effective supply chain
Senior Materials Engineer, Global Sourcing & Procurement
* Managed surface mount materials suppliers and development programs for HVM certification focusing on technology, cost, quality, and availability
* Developed new halogen free (HF) flux and solder paste formulations to eliminate the use of environmentally sensitive materials and producing earth-friendly products ; developed fast flow underfill material and epoxy process for SFF packages and executed flawlessly to expand underfill capacity to meet forecast needs
* Supported wafer coat flux, chip attach flux, epoxy flux and solder paste development for 22nm node and beyond ensuring availability and dual source for certification and ramp
* Enabled syringe-level bulk feed system to maximize production per the extended flux time-on-tool increasing 4% run rate gain for the factory
* Strategized 2nd site Disaster Recovery Plan (DRP) to increased multiple suppliers’ availability on epoxy, solder paste, and flux materials
* Benchmarked supply chain quality in first-level interconnect flux material packaging to eliminate excursions and enhance process marginality at Chip Attach Module
* Performed quality operation system audit at suppliers to ensure copy exactly on HVM process, equipment, metrology, and manufacturing at suppliers
* Certified and transferred epoxy materials for desktop/mobile/server products for 65nm and 45nm nodes
* Enabled material scale-up to HVM resulted in a 25% cost reduction with estimated $130K saving on underfill in 2007 for all USFF products
* Drove RFID design and implementation for automated traceability to increase throughput for material validation in the factories
Senior Process Engineer, Fab/Sort Manufacturing
* Identified improvement in safety, quality, yield, cost, and mentoring technicians across all shifts to deliver best-in-class results for tool availability, cycle time, and device performance for 65 nm products
* Proactively applied Lean manufacturing principles to eliminate waste and achieve small and rapid improvements, saving $0.5M and eliminating 16 analytical operations
* Increased VFC and VFP Excursion Prevention health and tool availability by implementing L8 compatible templates and made significant improvement on VFC (from 69% to 89%) and VFP (from 89.5% to 96.8%)
* Optimized tool performance by de-confounding a cluster of defects (poly rocks and pups); designed DOE to help improve process, defect analysis, and reduction for the Diffusion Module
* Achieved cost saving on fabricated wafer and attained best-in-class on cost within the Intel factory network from new quartz qualification, increased wafer load size, consolidation of UTM/LTM wafers, regen pedestal qualification, and implementation of new-styled injector
Process and Equipment Engineer, Assembly Technology Development
* Provided technical direction and solution...
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