SUBJECT MATTER EXPERTISE
More than 20 years of experience in the following:
• Process and equipment engineering including development, yield/continuous improvement, defect / waste / cycle time reduction
• Electronics/semiconductor processes including Wafer Thinning/Backgrind, Thru-Silicon Via Drilling, Substrate Bumping, Wafer Saw/Singulation, Die Sort, Die Bond, Flip Chip, Wire Bond, Encapsulation
• Bonding wire and tooling design
• Six Sigma, Quality Control, Reliability, Failure Analysis, SPC, FMEA
• DOE, Statistical Analysis using Minitab, JMP, Origin statistical software
• SEM, SAM, x-ray, optical and laser microscopy
• SAP, Agile, Eyelit, ProAlpha manufacturing systems
• AutoCAD, Microsoft Project/Excel/Word/Powerpoint software
• Technical sales, project management, product marketing and applications engineering
SIGNIFICANT ACCOMPLISHMENTS
• Lead the sales, marketing and applications team in managing and increasing US$6.0M per annum revenues from all North and South American semiconductor accounts of Small Precision Tools
• Developed post-fabrication process of PIN photodiodes for Macom and transferred process to contract manufacturer Fabrinet in Thailand
• Mass-production conversions of Au bonding wire diameters from 0.9- to 0.6mil for MEMS microphones resulting in annual savings of US$2.1M for Knowles Electronics; Process Development Achievement 2012 award received
• Developed low-loop wire bonding allowing production of low-profile MEMS microphones for Knowles Electronics; Process Development Achievement 2012 award received
• Mass-production conversion of ASIC and MEMS components allowing device miniaturization and increased component supply resulting in combined annual savings of US$2.9M for Knowles Electronics
• Developed wafer bumping processes using Au or PtIr wires enabling the manufacture of translators used in wafer testing for Advanced Inquiry Systems
• Developed and commercialized FP2, AW99, Radix, Radix Plus, Formax, AW9 and Maxsoft gold and copper bonding and bumping wires
• Established the applications engineering laboratory of Kulicke & Soffa in Singapore
o The facility is the primary development center for the company's bonding wire products
• Established the wafer backgrinding facility of Unisem in Indonesia—a first for the country
o The facility processes about 12,000 wafers a month with annual revenues of US$1.15M
• Established the wafer backgrinding facility of Amkor Technology in the Philippines
o The facility processes about 35,000 wafers a month with annual revenues of US$4.6M
• Received 3 patents/patent publication and co-wrote 11 technical publications on semiconductor interconnection
EMPLOYMENT HISTORY
Small Precision Tools, US 06/2016 – Present
Technical Sales Manager
• Lead the sales/customer service team in providing semiconductor tooling solutions to customers in the Americas
• Coordinate with US and overseas product management, engineering and production teams to ensure best design and delivery of tools to customers
MA/COM Technology Solutions, US (Production transferred to Thailand) 01/2016 – 06/2016
Post-Fab Engineering Manager
• Lead a team of test and process/equipment engineers in supporting in-house and subcontractor manufacturing and development of semiconductor lasers
• Provide support for quality management and test equipment development
• Closely work with wafer fabs to qualify new products, processes, and product improvements
Knowles Electronics, US 2010 – 2015
Senior Process Development Engineer
• Responsible for MEMS microphone process development and equipment engineering
• Led the qualification and initial production of new MEMS and ASIC devices in the USA and Asia manufacturing sites
• Responsible for product performance innovation, quality improvement and material cost reduction
Advanced Inquiry Systems, US 2008 – 2010
Senior Process Engineer
• Responsible for wafer tester contact engineering
• Led the development of wafer tester translator processing and quality control
Kulicke & Soffa, Singapore 1997 – 2008
R&D Manager
• Responsible for product development and marketing of wire bonders, bonding wires and tools
• Responsible for customer qualifications and product support for wire bonders, wires and tools worldwide
• Established the R&D applications laboratory in Singapore
• Previous positions: Applications Engineer, Senior R&D Applications Engineer, Senior Product Marketing Engineer, Technical Solutions Manager
Unisem (formerly Astra Microtronics Technology), Indonesia 1996 – 1997
Senior Engineer
• Established the first wafer back-grinding facility in Indonesia
• Responsible for wire bond process engineering
Amkor Technology, Philippines 1995 – 1996
Senior Engineer
• Established the 2nd wafer back-grinding facility in the Philippines
• Previous position: Engineer III
Texas Instruments, Philippines 1991 – 1995
Engineer III
• Responsible for the wire bond process and equipment engineering of PDIP/PLCC products
PATENTS
1. ...
Login or Register to view the full resume.
