Minks

8/21/2014
Poughkeepsie, NY

Position Desired

Process Engineering
Anywhere in the U.S.
Yes

Resume

SUMMARY

Versatile NANOSCALE & CHEMICAL ENGINEERING PROFESSIONAL with comprehensive microelectronics technology experience focusing on manufacturing, process, and development. Exceptional skills developing plans for new or enhanced products and technologies leading to new processes, equipment, and scientific application. Recognized technology advisor providing guidance and leadership to peers. Demonstrated success managing and implementing solutions addressing enterprise-wide needs while maximizing business value from technology investment.
Areas of Expertise:
­ C4 Plating
­ SemiGear & BTU Reflow Process/Tools
­ Flux Apply & Flux Clean Operations
­ Laser Mask Manufacturing
­ Decoupling Capacitor Manufacturing (DCAP)
­ 3D Development & Manufacturing Support
­ Metal Thin Films & Oxides Deposition by High Vacuum Technologies
­ Process Chemicals Analysis & Chemistries Distribution to Reactors/Baths


PROFESSIONAL EXPERIENCE

IBM, East Fishkill and Poughkeepsie, NY
(Systems and Technology Group)
PROCESS / MANUFACTURING ENGINEER, LEAD ENGINEER 2000 - 2013
(C4 Plating Engineering Sectors)
Developed C4NP processes and manufacturing support in mold cleaning operation. Supported manufacturing and controlled reflow processes in SemiGear and BTU tools. Administered Flux apply & clean operations.
­ Facilitated 3D development and manufacturing support operations at plating in Nexx tools, PECVD oxide and nitride deposition, wafer and glass grind operations in disco tools by producing 10 wafers daily.
­ Increased production capacity from 360 to 450 wafers per day by reducing C4 Steag Plating tool down-time and optimizing process recipes.
­ Decreased production cost and cycle time by implementing enhancements and parameters optimization at plating, resist strip, and chemical etch processes.
­ Facilitated sector utilizing lead-free material in less than 2 years by contributing to development, qualification, and alternate materials/processes implementation.
­ Diminished chemical source material and cycle time 25% by enhancing and optimizing mold clean process.
­ Outlined process recipes and steps by producing manufacturing process specification documentation.
­ Reduced utilized engineers per production scheduling, saving manpower costs, by controlling and supporting multiple operations including FSI-MSA oxide removal process, STI-MSA clean, vertical and horizontal electrolytic etches, and resist strip.
­ Analyzed plating and etch reactors Chemistries for process control and chemical distribution by employing personnel with chemical carts and pump stations.
­ Supported product yield management by addressing manufacturing parameters for productivity improvements.
­ Coordinated annual manufacturing line cleanroom certification and controlled cleanroom contamination by writing essential documentation and training personnel.
­ Improved quality customer satisfaction 20%, reducing critical product launch time 3 months, by applying consistent / continuous process enhancements, and employing lean control practices.
­ Enabled streamlined technical transformation, simplifying non-technical terms and language by educating staff and writing process documentation.

INTERCONNECT PRODUCTS MANUFACTURING, LEAD ENGINEER 1998 - 2000
(Laser Mask and Decoupling Capacitor (DCAP) Manufacturing Engineering sectors)
Designed and optimized chrome, copper, and lead (Pb) evaporation processes. Provided C4-reflow process development and manufacturing support. Delivered process control of wafer redistribution including metal sputter & chemical etch. Supported operations and process control of polyimide (resist) strip & aluminum chemical etch operations.
­ Aided operator capabilities by writing manufacturing process specification documentation.
­ Sustained lead-free development by establishing alternate materials and process for lead (Pb) solder employing injection molten metal solder and paste screening operations.
­ Enhanced production yields 90 to 99% by influencing contamination control task forces and lean control practices.

Additional roles held PROCESS ENGINEER (Pipeline Management and New Product Manufacturing & Thin Film Metallization)

ADDITIONAL RELEVANT EXPERIENCE

POLAROID CORPORATION, Waltham, MA
ENGINEERING INTERN, Waltham, MA and Cambridge, MA

NORTH CAROLINA A&T STATE UNIVERSITY, Greensboro, NC
TEACHING ASSISTANT (Chemical Engineering Department)
TEACHING / RESEARCH ASSISTANT (Chemistry Department)

BENNETT COLLEGE, Greensboro, NC
ASSISTANT INSTRUCTOR (Chemistry)

AHMADIYYA SECONDARY SCHOOL,...

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