EDUCATION:
B.S., Electrical Engineering, May 1999 from Florida State University
M.S., Materials Engineering, December 2011 from University of California, Los Angeles
WORK EXPERIENCE:
September 2011 – Present, Senior Engineering Specialist
Bell Helicopter
Ft. Worth, TX
* Perform root cause analysis for failed components through engineering investigations
* Develop corrective action plans and participate in reliability review scoring boards
* Determine component failure modes utilizing Weibull analysis and other statistical methods
* Apply Monte-Carlo simulation techniques to determine corrective action effectiveness
July 2008 – August 2011, Staff Systems Engineer
Lockheed Martin Corporation
Orlando, FL
* Develop Aging/HALT plans and perform Aging/Accelerated testing
* Perform reliability predictions and functional FMECA
* Developed worst-case circuit analysis and parts stress derating guidelines
* Develop supplier documentation (reliability requirements and statement of work)
* Review supplier reliability analyses to insure the proper ground rules and/or requirements are met
* Develop signal-level FMECA on FPGA for system safety analyses
* Update reliability data in FRACAS system and support vendor telecoms
October 2005 - July 2008, Senior Reliability Engineer
Ball Aerospace & Technologies Corporation
Boulder, CO
* Developed and simulated system reliability models
* Performed worst-case circuit analysis (Extreme Value & Monte Carlo)
* Developed reliability program, aging, HALT and modeling plans
* Developed supplier documentation (reliability requirements and statement of work)
* Performed reliability predictions, FMECA, part stress derating and system reliability modeling
* Developed Basis of Estimate (BOE) to estimate task/labor hours associated with proposals
* Planning and scheduling of program reliability analyses, including CDRLs
* Reviewed supplier reliability analyses (SDRLs) to insure requirements were met
June 2001 - October 2005, Senior Systems Engineer
Raytheon Company, Missile Systems
Tucson, AZ
* Performed sectioning, grinding, polishing of metallic and ceramic samples
* Utilized optical microscope, SEM, EDS and XRD to characterize materials
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