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EXPERIENCED THIN FILMS ENGINEER
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Summary
• Highly experienced Thin Films engineer with long team management experience
• Highly efficient in team or individual environment
• Expert in process development , trouble shooting, continuous monitoring and improvement
• Qualifications include a Ph.D. in Physics including extensive scientific and technical background in thin films in the areas of semiconductor technology and optical coating
Professional Skills
• 10 years of experience in Thin Films material synthesis: metals and inorganic dielectrics
• 10 years of combined experiences with Physical Vapor Deposition (PVD): Sputtering, RF-Sputtering, e-beam included ion beam assisted e-beam, etc.
• 10 years of combined experiences with Chemical Vapor Deposition (CVD): PECVD, MOCVD, RPECVD.
• 10 years of combined experiences with electrochemical Deposition: electro-plating, electroless plating
• 10 years of combined experiences with Thin Film characterization: XPS, AES, RBS, FTIR, SEM, XRD, HREELS, FIB-SEM
• 10 years of combined experiences with Thin Films metrology : ellipsometry, profilometry, quartz monitoring, etc
• 10 years of combined experiences with substrate surface cleanness characterization: particle counts, wafer cleaning including etching
• 7 years of combined experiences with photo-lithography
• 5 years of combined experience with PZT ceramics
• Process development , improvement and reliability
• Process integration
• Six-Sigma and Lean methodologies: DOE, SPC, FMEA, 5S, 8D’s, etc.
• Yield Improvement / defects tracking and elimination
• 7 years combined experiences as teams manager
• Process documentations creation
• Solid scientific background including optical physics, Solid State Physics, Physics of Semiconductors devices, Material Sciences, Statistics, Surface & Interface Physics, Vacuum & Ultra-vacuum Science, etc.
• Extended computation expertise
• Cleanroom Manufacturing & Engineering
• Product R&D/Prototyping
Work Experience
Sonavation, Inc. -- Palm Beach Gardens, Florida
Production Manager/ Sr. Process Engineer, 03/08 – Present
Hired to streamline the lithography-thin films operation and improve its overall yield. Promoted later to manage the full 1:3 PZT Composite base bio-sensitive fingerprint sensors production line from front end to back end. In that quality oversaw production piloting and mass production deployment to Taiwan.
Accomplishment Highlights:
• Assisted substrate fabrication process development including bare tile conversion to 1:3 PZT Composite of the PZT ceramic
• Optimize lithography process which led to minimization of lithography induced defects using six-sigma methodology.
• Developed sputtering processes for sensor electrodes metallization
• Integration of processes across production line leading to overall yield improvement
• Introduced all processing and quality control documentations
• Introduced all Six-Sigma and Lean methodology including SPC, FMEA, Process Control Plan, etc to Sonavation.
• Trained technicians
Intel Corporation, Hillsboro, Oregon
Diffusion/Thin Film Sr. Engineer, Gate Polysilicon Layer Owner, 11/05 – 06/07
Polysilicon layer process owner. Duties included production sustainment which includes polysilicon operation daily yield tracking, day to day process trouble shooting, and operation sustaining.
Accomplishment Highlights:
• Introduced and qualified polysilicon layers for 90 nm and 65 nm node technologies
• Redefined defects qualification leading to substantial improvement of polysilicon vertical CVD reactor troubleshooting process.
• Involved through the polysilicon layer in the maturation process of the 90 nm and 65 nm node technologies prior to transfer to production sites
SUMCO-USA (Sumitomo Mitsubishi Silicon Corporation), Salem, Oregon
Senior Process Engineer / Lead Engineer managing Thin Films & Silicon Wafer Etch Ops 07/2001 – 07/2005
Brought in to lead the Thin Films operation and in charge of processes development & continuous improvement. Later promoted to supervisory position for the thin films operation and the silicon wafer etch. Main duty included daily yield tracking, overall yield improvements through yield killers identification and elimination using root-cause-analysis methodology; provide assistance to equipment maintenance efforts
Accomplishment Highlights:
• Optimized yield for thin films (THF) operation leading to yield boost from 93.4% to 98.8% in two years.
• Optimized thermal oxide deposition on silicon
• Optimized PECVD process for field oxide deposition
• Debugged wafer etch process leading to escalation of the yield from 69.0% to 93.0% in three years.
• Created and upgraded Sumco-USA at Salem documents for QS9000 qualification readiness
• Supervision of junior engineers, engineer technicians and operators.
• Supervise implementation of Six Sigma methodology at SUMCO-USAat Salem and training of junior engineers and engineer techs.
JDS-Uniphase, Electrooptic and Photonics Division (EPD) - Bloomfield, Connecticut
Senior Thin Film Materials Scientist, 01/2000 –07/ 2001
Main duty involved fine tuning dielectrics optical properties (n and k) to meet 40GB generation of lithium niobate based electrooptic modulator buffer layer requirements; development of semi-metals thin films acting as charge bleeding layers to that generation of modulators; development of manufacturing processes and assistance to process transfer to production.
Accomplishment Highlights:
• Successfully developed special buffer layer for high speed lithium niobate (LiNbO3) based electrooptic modulator in less than one year for 40 GB based new generation modulators.
• Assisted in target fabrication for reactive RF-sputtering of special buffer oxide
• Designed charge bleeding layer essential to operation of 40 GB electro optic modulator and developed production process in less than one year.
• Introduced thin films characterization for monitoring of thin films elementary compositions
• Completed transfer to production of new 40 GB modulators processes ahead of schedule.
Albany Nan...
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