OBJECTIVE:
To obtain a job position in the following industries: Material Science Engineering, Chemical Engineering, Process Engineering, Nano-technology, and Aerospace Engineering.
EDUCATION:
UNIVERSITY OF CALIFORNIA, LOS ANGELES Expected Dec 2013
Bachelor of Science, Chemistry/Material Science GPA: 2.99
Relevant Coursework:
•Physics of Materials: Semiconductor
•Semiconductor Laboratory (Clean room, MEMS, Lithography, MOSFET, MESFET, CVD, PVD, etc.)
•Materials Chemistry Laboratory (LED, Nanoparticles, Gas Sensor, Solar cell, etc.)
•Principles of Electronic Materials Processing: Semiconductor Processing (VLSI, Ion Implantation, Wafer Processing, etc.)
•Introduction to Materials Characterization A (Crystal Structure, Nanostructures, and X-Ray Scattering)
•Introduction to Materials Characterization A Laboratory (Principle of XRD and X-Ray Diffractometer Operation)
•Physical Chemistry: Introduction to Quantum Mechanics
•Physical Chemistry: Chemical Thermodynamics
•Intermediate Inorganic Chemistry
•Advanced Inorganic Chemistry
•Structure and Properties of Metallic Alloys
•Introduction to Ceramics and Glasses
LAB TECHNIQUES:
•Operation of X-Ray Diffractometer (XRD) and Analysis of X-Ray Diffraction Scan
•Chemical-Mechanical Polishing Skills for Wafer Bonding
•Material Process & Thin Films Engineering (Photolithography, Reactive Ion Etching, Sputtering, Wet Etching, Spin-coating, Wafer Processing , Clean room experience, etc.)
•Solar Cell and LED Manufacturing
•Lab View, Microsoft Excel, PowerPoint
RELEVENT EXPERIENCE:
UNIVERSITY OF CALIFORNIA, LOS ANGELES Los Angeles, CA
Research Assistant Sep. 2012 - Now
•Research Title: Chemical-Mechanical Polishing YAG for Wafer Bonding
•Cleaning polishing equipments and disposing waste from polishing
•Preparing polishing set-ups (even distribution of polishing slurries, maintenance of cleanness)
•Confirmation of thickness uniformity in Si-Wafer via microscope
•Conducting measurement of waf...
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