EDUCATION
Master of Science in Materials Science & Engineering
University of Kiel, Germany (11/2007)
- Thesis research carried out at the University of Michigan
- Topic: Growth and characterization of III-V semiconductors for use in high-speed photonic and terahertz devices.
Bachelor of Science in Electrical & Computer Engineering
California State University, Chico, CA (05/1998)
APPLICATIONS
Microsoft Office, Microsoft Project, SAP, AutoCAD, Origin
SKILLS
Project management, product development, engineering management, technical customer management, technical writing & documentation, problem solving, self-direction, materials science, electron microscopy, infrared thermography, failure analysis, quality assurance, supplier quality, reliability testing, manufacturing, semiconductors, optoelectronics, hybrid assembly, microelectronics, high vacuum system operation and maintenance, hardware engineering, software development
EXPERIENCE
Carl Zeiss Microscopy, LLC
Ann Arbor, MI
Electron & Ion Microscopy Specialist (04/2013 – present)
• Field applications engineering for electron and ion microscopy customers in materials research & development, quality assurance/control, and reliability sector. Interface with customer in defining technical specifications and custom system configuration.
• Provide post installation customer training, technical guidance, and customer specific technical documentation to ensure successful system execution and exceed customer expectations. Ensure accuracy of technical documentation and provide feedback regarding data sheets and marketing literature.
• Facilitate required and recommended instrument upgrades to ensure the customer maintains the most advanced capabilities.
• Work closely with Product Management on new product features, product bundling, and custom solutions to meet customers’ changing needs.
Picometrix, an Advanced Photonics Company
Ann Arbor, MI
Materials Science Engineer, Engineering Supervisor (01/2008 – 04/2013)
• Design for Manufacturing (DFM) lead engineer for hybrid optoelectronic products. Evaluated and improved manufacturing processes and product design to increase quality, reduce variability, and increase production yield.
• Principal engineer for product and process failure analysis including RMA and field issues. Integrated solutions derived from failure analysis of existing products into new products for increased quality and reliability. Extensive micro- and nano-scale analysis of in-house manufactured semiconductors, photodiodes, and metallic thin film ceramic substrates using electron microscopy and focused ion milling.
• Responsible for product qualification testing and process change validation. Accountable for all continuous product improvement engineering activities.
• R&D Engineering point of contact for quality and manufacturing issues across multiple optoelectronic product lines. Introduced new standards on quality, process control, and materials handling including the complete revamping of core manufacturing practices/processes.
University of Michigan
Ann Arbor, MI
Material Science and Engineering Research Assistant (Graduate thesis work)
(10/2006 – 01/2008)
• Responsible for extreme low temperature growth of III-V semiconductors using molecular beam epitaxy (MBE) for use in photonic and terahertz radiation devices.
• Repaired and maintained high vacuum MBE system. Successfully, trouble shot band-gap-edge monitoring system for low-temperature semiconductor growth which had previously never performed to product specification.
• Proficient in electron and ion based materials analysis of semiconductor and photodiode devices.
• Cross-sectional material analysis of nano-scale features of prototype III-V heterostructure semiconductors.
• Collaborated (under NDA) with Picometrix scientists and engineers on comparative analysis and characterization of patented semiconductor and photonic devices.
• Regularly presented findings to Picometrix management.
Fraunhofer Institute for Silicon Technology
Itzehoe, Germany
Materials Engineer (Graduate internship)
(07/2004 – 10/2004)
• Developed and tested Micro-Electro-Mechanical Systems (MEMS) based 3-D accelerometer for the German automobile industry.
• Built initial MEMS gyroscope test board as part of an integrated manufacturing process.
Hewlett-Packard (HP Consulting Services) (11/2000 – 01/2003)
Engineering Consultant (Böblingen, Germany) ...
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