Objective PCB Layout designer
Summary of Education University in Sarajevo, Economic and Marketing, CAD Design School, High School, School for Electronic Technician and University of Sarajevo- 3 years, Bosnia & Herzegovina
• Course in High Speed Design, Boston 09.2000
• Course in High Speed design and Signal Integrity- Lee Ritchey
• Course in High Speed design for PCB Designers - Lee Ritchey
• Course in How to use HDI/Micro vias - Mike Fitts
• EMI Crosstalk & Control - Rick Hartley.
• Advance Place and Route Technique
• Course in Cadence Advance Specctra router –Ottawa- Certified program 2001
• Course in Advance Cadence Concept –Ottawa- Certificate program 2001
• Course in Advance Cadence Library Management- Certificate program 2001
• Course in Advance Cadence Allegro PCB - Certificate program 2001
• Course in Mentor Graphics- San Jose – Certificate program Nov. 2000
• Course in Mentor AARE auto router –Ottawa- Certificate program Dec. 2000
Skills
• More than 25 years of experience in the Design of Printed Circuit Boards
• MIL CGP Controlled Goods program registration number CG14988
• In-depth knowledge of PCB Analog and Digital High Speed design.
• The Experts knowledge of Expedition with CES, Allegro Constraint Manager
• BoardStation ISDN 2002 and Board Station XE7.9.4
• MentorGraphics Pads and DxDesigner
• Cadence Concept HDL, Orcad Schematic
• AltiumProtel 3.1 and Altium 10
• PCAD 8.5 and Accel 2000 & 2006
• VALOR NPI 9.2 and CAM350
• Mechanical skills with knowledge of Autocad, Solidworks, Solidedge
• Design of Heat sinks and assembly using 3D Solidworks Modeling
• Familiar with IPC design and assembly standards, practices, and procedures,Y14.5-1994 drafting.
• SAP,CVS and MKS Source Integrity for data and library control
Design layout of complex, multilayer, high-density SMT, digital and analog PCB’s. Perform schematic edits, create fabrication drawings and data package, prepare assembly drawings and verify BOM's. Work closely with PCB fabricator and engineering to insure a producible product.
• Work in a small multidisciplinary team or be remotely independent
• Participate in mechanical, hardware and system design reviews
• Communicate complex technical concepts and ideas
• Strong communication skills (verbal and written) required for interaction within group, with customers, R&D, and international colleagues. Demonstrated problem solving and decision making skills
• Working with minimal supervision
• Demonstrated flexibility and initiative
• Excellent organizational skills
Technical Experience
• Operating Systems: WINDOWS,DOS, UNIX
• Knowledge and experience in routing various Bus Types include USB, Front Side Buses, Fully Buffered Dimms, DDR, DDR2,DDR3, PCI, PCI-Express, VME, Video and power supply design. Highly experienced in high density interconnect (HDI) strategies; experienced in flexible printed circuit (FPC) design; proficient in the use of Mentor Graphics tools specifically Expedition, Board Station and Design Capture; knowledgeable in design for manufacturability (DFM) guidelines;
• Standard BGA technologies including small 0.5mm pitch,HDI via size with drill size 5th
• Most of the work done in last 10 years for MILL spec class II and III.
• Specialized in high speed digital printed circuit boards for telecommunication standards. Extensive experience with proper routing techniques of differential signals and routing of tight tolerance, length matched, large bit count busses including DDR2 and DDR3 memory interfaces.
Employment & Representative Projects
SAFRAN Electronic Canada - Design of MIL Boards in Cadence PSD16.5 Jan2012- May 2014
Design of power boards for Aerospace customers, Training in CIS and reuse Modules for
Eng department 1 day course. Training and organization of PCB department for the new process and to bring junior PCB designer up the speed.
Comtest Networks- Contract Design . Dec –Jan 2012
Redesign of Customer boards in PCAD 2006 to meet required dielectric separation.
GE Transportation, PA-Contract Design . Nov 2012-Jan2013
Servo Motor Control Board. Design done in Board StationBoard Station XE7.9.3 and Translated in to Expedition 2005.3.
GE Intelligent Platforms - Lead Design eng. June 2006-Jan 2013
Primary responsibilities include designing PCB's for new products and make improvements to existing products, and generating documents using computer aided drafting (CAD) for schematic, assembly, and fabrication drawings.
Last project was done with Virtex 6 with 2 ADC and DAC along with 12 DDR3 running on 553MHz with controlled impedance on 20 layers PCMCI size cards.
Solidworks 3 D assembly with full details and I was building heat sink metalwork.
Also I am maintaining Cadence Orcad and Allegro legacy designs and libraries.
Conversion Cadence and Orcad to Expedition. List of products ICS-1650, ICS- 8580(Video card) ,ICS-1572,SPR131.SPR132, SPR870A..
Tool used Orcad 10, Cadence 15.5.1 and Expedition 2005- to 9.4 DX.
Solidworks for PCB assembly and Metal work
ACE Florida - Remote Design February 2012
PCB Designer Contract
Design of memory DDR SDRAM Die U67 based on 5 x DDR2 512 Micron.SI done with HypeLynx 8.1 ( BGA 256 pins Die )
SI review of design done in PADS.Focus on DDD3 timing of ADDR and data as well PCIe timing review.
L3- Communication Systems October 2011
CGP project for Power Supply mobile Unit done in Expedition 12 layer card.
Schematic in Orcad for power supply system of II Generation.
Part of the contract was to deliver proto bare PCB Boards.
L3- Communication Systems July 2011
ITAR project for Aerospace .
Schematic in Orcad for power supply system of 8 layer card with one 1136 pin BGA.
ACE Florida April 2009 -2010
Translation of Allegro 15.51 design in to Pads2005.2
Protel 99 redesign of the PCB Analog digital Board.
Redesign of the Analog board in PADS 2005.2
L3- Communication Systems-Preferred Supplier Contractor March 2010
ITAR project for Aerospace in Spain.Recovery of the boar...
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