Summary:
Experienced engineering and laboratory technician with a background in R&D/NPI products and processes. Extensive background in several regulated industries at different functional levels. Knowledgeable in the implementation and compliance of customer and regulatory systems and standards. Specific customers/specifications interacted with include; Lockheed Martin, General Motors, Ford, USCAR, SAE, Delphi Automotive, Toyota, ASTM, Plastipak, U.S. Government/Military, and Honda. Skilled in assessment and implementation of job tracking systems and instruction of others on their use. Knowledgeable in specialized software with the ability to quickly master new systems.
Experience:
R&D Process Technician October 2013 – December 2014
PlastiPak Packaging Inc.
Medina, Ohio 44256
- Performed equipment change overs on a Sidel Universal 2/8 to different setups; per engineering requirements
- Manufactured new designs of products for R&D/NPI
- Performed complete R&D/NPI production runs on samples; with in-process validation of equipment/process performance to specification
- Performed in-process inspection/testing of R&D/NPI products before submitting samples to Quality for validation
- Assisted Quality Control lab with validation on R&D/NPI bottles
- Performed manufacturing processes in compliance with Food Safety, HACCP, and GMP
- Prepared product for shipment to customers
- Performed internal audits to industry standards
Materials Lab Technician/Specialist January 2013 - October 2013
Orrvilon, A Division of Holtec Inc.
Orrville, Ohio 44667
- Performed material testing of production and R&D material to ASTM standards
- Qualified new MTS tensile tester to ASTM standards
- Set up and qualified a Tinius Olsen Charpy measurement device
- Wrote dedicated work instructions for specialized testing of products
- Worked on setting up the initial database for work coming into the lab, including job creation for traceability
- Acted as part of Quality Assurance and Quality Control for products shipped to customers
- Worked with the wet chemistry group on Chemical Safety and proper chemical storage and usage in compliance with industry standards
Laboratory Technician Spec July 2007 - January 2013
Lockheed Martin
Akron, Ohio 44306
- Managed the Environmental Test Lab for the whole facility
- Implement Environmental Testing for R&D and production qualifications
- Setup and performed vibration testing for R&D and production acceptance of products
- Accomplished physical testing on materials for NPI and Development products
- Performed physical qualification testing and quality assurance testing to specifications
- Executed failure analysis on products (SEM, light microscopy)
- Setup and ran specialized test setups per Engineering standards
- Verified chemistry was within specification for production Chemical Film line
- Obtained Certified Test Operator and Certified Torque Operator status
- Worked with Engineering and Quality Assurance on product standards and acceptance
- Performed DPA on Integrated Circuit components and with the aid of an SEM
- Performed Chemical Safety of chemicals used in Lab Areas, chemical hazards/protocols with co-workers, and ergonomics for work areas
- Complied with all EHS regulations
Analytical Lab Manager April 2007 - June 2007
Powdermet Inc. On Assignment (Contract)
Euclid, Ohio 44117
- Assisted with setup and startup of equipment for lab analysis (XRD, Flame AA, SEM)
- Performed small equipment repairs on tools and equipment
- Designed and implemented an incoming/outgoing Excel database for tracking work
- Performed testing on R&D material, along with checking production material; particle size, particle density, composition
- Worked with Quality to insure product compliance to customer specifications
- Kept the lab as a neat and tidy work area
- Organized chemicals to comply with safety standards
PFA/SEM Lab Technician March 2005 - March 2007
IBM East Fishkill Research Park Gonzer and Associates (Contract)
Hopewell Junction, N.Y. 12533
- Performed physical failure analysis on semiconductors with the aid of a FE-SEM
- Inspected internal structures of production and developmental chips (ISO VIA, N-Fet, P-Fet, Deep Trench Arrays, Isolated structures)
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