MANUFACTURING PROCESS ENGINEER
Creative, hands-on, manufacturing process engineer offers a proven track record of success in Intel chip package assembly and fab manufacturing; experience includes equipment and process owner for multiple robotic assembly tool sets, as well as clean room wafer fabrication experience as a defect metrology process engineer. Known for leading process improvement/innovation and driving quality deliverables with strict timelines/budgets.
CORE STRENGTHS
Chemical Engineering – Mechanical Engineering – Process Engineering – Ultrasound Metrology – Material Science
Electronics Packaging – Failure Analysis– Shock & Vibration Testing – R&D – DOE – JMP – Lean Manufacturing
Six Sigma Methodologies – Tool Selection – Supplier Management – Training & Development – Team Building
SELECT CAREER HIGHLIGHTS
•Trained 15 NPI manufacturing engineers to significantly improved key indicators within a year, including doubling NPI starts and speed through factory, cutting excursions 50%, and reducing unscheduled holds 4X.
•Designed new lid attach, dispense, P&P, cure, and metrology processes to meet demands of three generations Intel Server packaging requirements; helped with supplier selection and new equipment qualification, drove improvements, and ensured the creation of a viable, integrated process under tight timelines.
•Developed a new wafer laser process enable singulation of Intel Low-K silicon CPUs; participated in supplier selection and new equipment qualification, drove technology improvements, and added additional process steps to create a viable, integrated process under tight timelines.
•Qualified 50 Thin film Metrology tools in under a year in Intel’s fastest 24/7 Fab start up in company history. Met tight timelines in the highly ambiguous environment of a under construction partially completed fab.
PROFESSIONAL OVERVIEW
INTEL SEMICONDUCTOR
Manufacturing Engineer (2004-2015)
•Served as recipe engineering team lead on process development of wafer to die preparation steps and electronic packaging processes utilizing thermal heat spreaders to certify quality and transfer processes to high volume manufacturing sites. Owner for daily floor operational and hands on equipment reviews to deliver to safety, availability, yield, and quality metrics.
•Delivered to technology roadmaps aligning product requirements to process capability needs.
•Specified new equipment procurement requirements, and managed supplier selections
•Tracked quarterly objectives across team for successful delivery of project improvements to schedule.
•Programmed and built the first of a process hand carry million-dollar wafer in order to enhance 24 hour turn time of the final fab validation check out wafer; completed twice a year (20 times in all) during tenure.
•Reduced area quality excursion rates by 50% applying Lean TPS methods.
•Reduced process throughput time requirements by 50% and reduced labor requirements by half through improved automated process quality feedback controls
•Proactively developed new thermal solution process for smallest microprocessor for automotive infotainment business, delivering to performance, reliability and cost targets.
•Drove new metrology techniques for critical process controls including QV, CSAM, and Optical Inspection.
•Saved millions in designating thermal interface materials to product application spaces by developing thermal reliability models for...
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