PROFESSIONAL SUMMARY
More than 9 years of experience in process and manufacturing engineering, working extensively with epitaxial growth of III-V compound semiconductors and etching processes in the fabrication of MOSFET’s. Highly experienced and skilled in statistical process control and engineering in high volume manufacturing clean room environment. Extensive training on Six Sigma principles (green belt) and its application. Expert in LEAN manufacturing. Certified on K475 Veeco MOCVD and M712 Hitachi equipment training. Highly successful in leading multi-disciplined teams to optimize factory OEE, to reduce operational cost, and to transition new products from research and development (R&D) to high volume manufacturing. Excellent interpersonal, customer service, decision making, and problem solving skills. Strong organizational, presentation, and writing skills. Excellent computer literacy. Highly motivated, productive, results and detail oriented, driven, and a team player.
EMPLOYMENT HISTORY
MOCVD Staff Engineer
Spectrolab Inc., A Boeing Company, Sylmar, CA Oct. ‘07 – Present
• In charge of 5 E400 Emcore and 4 K475 Veeco MOCVD reactors in high volume 100 mm and 150 mm semiconductor manufacturing fabrication factory (3,500 wafers/week). Responsible for the fabrication of 100 mm and 150 mm high efficiency InGaP/InGaAs/Ge triple junction solar cells for both space and terrestrial applications.
• Lead multi-cross functional teams in LEAN manufacturing to reduce cycle time in solar cell production and participate in 5S events.
• Lead cross discipline teams across the factory from FE to BE to optimize OEE, to improve operational cost and overall yield in the factory.
• Manage daily solar cell production throughput, yield, and OEE. Coordinate with cross-functional teams in MOCVD to achieve highest quality products and on time delivery.
• Perform microscopic inspection of grown solar cells and analyze particulate/haze defects using KLA Tencor Surfscan machine. Expert in Surfscan and lead inspection capability study.
• Update, audit, and author procedures to improve and optimize production processes and MOCVD equipment maintenance effectiveness.
• Utilize statistical process control (SPC) rules and Six Sigma principles to ensure solar cell electrical performance is in control and within specification limits, and perform DOE to explore new process boundaries to improve process capability.
• Apply RCCA and FMEA processes to resolve production process anomalies.
• In charge of new product introduction (NPI) transition from R&D to high volume manufacturing through satisfying the Manufacturing Capability Readiness Review (MCRR) process.
Process Engineer (Module Owner)
Intel Corporation, Ronler Acres Campus, Hillsboro, OR Jul. ‘05 – Oct. ‘07
• Module owner of 6 M712 Hitachi Etchers in fast paced, high volume 300 mm semiconductor manufacturing fabrication facility. Responsible for isolation trench, poly-Si gate, and polyimide passivation plasma etching processes in the fabrication of MOSFET devices for computer processors. Also in charge of MIM plasma etching processes that include the etching of SLAM, nitride, and Tantalum metal in the fabrication of communication chips.
• Worked with photolithography processes used to pattern poly-Si transistor gate and MIM to prepare plasma etch of SLAM/nitride/Ta materials.
• Worked with dry etch process using reactive, toxic and non toxic gases/flammable materials in high power MW plasma, RF, and ultra high vacuum environment.
ACHIEVEMENTS
• Won the “Boeing World Class Engineer Award” and “Employee of the Month” award from Spectrolab Inc. for Q1 ’15.
• Won “Team of the Quarter” award from Spectrolab Inc. for major contribution in the RCCA investigation on reactor base plate leak issue that was repaired after 6 months of downtime in ’09.
• Won the Logic Technology Development (LTD) Divisional Award in Q4 ’05 for highest tool availability, lowest cost, and highest inline yield performance at Intel Corp.
• Developed a modified etching recipe in one of the M712 etchers, which eliminated the defect reliability risk discovered in the process. Won the Logic Technology Development (LTD) Divisional Award in Q3 '06 for the design of experiment (DOE) and implementation at Intel Corp.
• Project leader at Spectrolab Inc.: Led RCCA team to reduce particulate defects and implemented new growth temperature control strategy on K475 Veeco MOCVD reactors that eliminated haze defect seen on 150 mm solar cells. Both projects led to significant yield improvement (= $400K cost saving) in the 150 mm MOCVD production line in 2015.
• Led a cross-functional team in a LEAN event to reduce MOCVD manufacturing Minute Per Wafer (MPW) by 10%. Saved Spectrolab Inc. $130K per year by qualifying alternate supplier for wafer carrier (SGL Group, the Carbon Company) used to fabricate the solar ce...
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